Product Name

Brand

Main Role

Application Area

Performance Introduction

Dynamic wetting agent

MFD  W111

Dynamic wetting leveling

Photovoltaic wafer cutting

◇Improve the yield of silicon wafers, reduce line marks, TTV and dirty chips

◇High-efficiency wire cutting processing, reducing powder stacking

◇Improve the cooling performance of cutting fluid

Super wetting agent

MFD  HW1000

Dynamic wetting leveling

Photovoltaic wafer cutting

◇Low foam, low surface tension, excellent dynamic wettability

◇Good compatibility, easy to mix

◇Low addition

Trans-block polyether

MFD  W2000

Lubrication dispersion

Photovoltaic wafer cutting

◇Polyether with special structure has better lubricity and is especially suitable for cutting large size silicon wafers

◇The dispersion effect of silicon powder is better and the yield is greatly improved

◇Good compatibility, easier to mix

Wetting leveling

MFD  W330

Dynamic wetting leveling

Lithium battery diaphragm

◇Excellent wettability, suitable for water-based high-speed coating

◇Rapid leveling can effectively solve the problems of coating defects and uneven thickness

◇Low foam to avoid fish eye problems caused by foam

High-purity graphene negative segregation material

MFD W560

Dynamic wetting leveling

Waterborne paint

◇Excellent dynamic wetting performance, greatly reducing system surface tension

◇Good wetting and dispersing effect on pigments and fillers

◇low-foaming